Issued Patents 2023
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855016 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2023-12-26 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Hao-Yi Tsai | 2023-12-26 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2023-12-19 |
| 11848235 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Che-Wei Hsu | 2023-12-19 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-12-19 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2023-11-28 |
| 11824017 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2023-11-21 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2023-10-24 |
| 11776905 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2023-10-03 |
| 11776880 | Surface treatment method and apparatus for semiconductor packaging | Chih-Horng Chang, Jie Deng, Ying-Yu Chen | 2023-10-03 |
| 11764171 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai | 2023-09-19 |
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11694966 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2023-07-04 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Shih-Wei Chen | 2023-07-04 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Hao-Yi Tsai | 2023-06-20 |
| 11682655 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Hao-Yi Tsai | 2023-06-20 |
| 11658143 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Chen-Shien Chen | 2023-05-23 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11631648 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Chen-Shien Chen, Yen-Liang Lin | 2023-04-18 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |