Issued Patents 2023
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855046 | Memory packages and methods of forming same | Chen-Hua Yu, Chung-Hao Tsai, Yih Wang | 2023-12-26 |
| 11854928 | Semiconductor package and manufacturing method thereof | Tzu-Chun Tang, Wei-Ting Chen, Chung-Hao Tsai | 2023-12-26 |
| 11848235 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Tin-Hao Kuo, Che-Wei Hsu | 2023-12-19 |
| 11841541 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2023-12-12 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2023-11-28 |
| 11830864 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-11-28 |
| 11784172 | Deep partition power delivery with deep trench capacitor | Chen-Hua Yu, Chung-Hao Tsai, Chieh-Yen Chen | 2023-10-10 |
| 11776905 | Package structure, package-on-package structure and manufacturing method thereof | Tin-Hao Kuo | 2023-10-03 |
| 11769731 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chung-Hao Tsai | 2023-09-26 |
| 11764823 | Method of using integrated transmitter and receiver front end module | En-Hsiang Yeh, Monsen Liu | 2023-09-19 |
| 11735576 | Integrated circuit package and method | Chen-Hua Yu, Chung-Hao Tsai | 2023-08-22 |
| 11728327 | Integrated circuit package and method | Chen-Hua Yu, Chung-Hao Tsai | 2023-08-15 |
| 11682583 | Through-vias and methods of forming the same | Chung-Hao Tsai, En-Hsiang Yeh | 2023-06-20 |
| 11676906 | Chip package and manufacturing method thereof | Chen-Hua Yu | 2023-06-13 |
| 11646313 | Semiconductor and circuit structures, and related methods | Chang-Fen Hu, Shao-Yu Li, Kuo-Ji Chen, Chih-Peng Lin, Ching-Fang Chen | 2023-05-09 |
| 11637097 | Method of manufacturing package structure | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2023-04-25 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11621244 | Integrated circuit package and method | Chen-Hua Yu, Chieh-Yen Chen, Wei Ling Chang | 2023-04-04 |
| 11605622 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-03-14 |
| 11600431 | InFO coil on metal plate with slot | Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2023-03-07 |
| 11587916 | Package structure and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Tzu-Chun Tang | 2023-02-21 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chen-Hua Yu, Chih-Yuan Chang | 2023-01-24 |