Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-12-19 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu +2 more | 2023-12-12 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2023-08-29 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Chih-Hsuan Tai +5 more | 2023-04-18 |
| 11580767 | Fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-02-14 |