Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2023-12-26 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai +2 more | 2023-12-12 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ying-Cheng Tseng +5 more | 2023-08-29 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2023-04-18 |