Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855210 | Method for fabricating a strained structure and structure formed | Tsung-Lin Lee, Chih-Hsin Ko, Feng Yuan, Jeff J. Xu | 2023-12-26 |
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2023-12-26 |
| 11844705 | Implant guide system for hip replacement surgery | Jiann-Jong Liau, Kui-Chou Huang, Yi-Wen Chen, Cheng-Ting Shih | 2023-12-19 |
| 11848363 | Method for forming semiconductor device | Chung-Ting Li, Jen-Hsiang Lu | 2023-12-19 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Yu-Chih Huang, Po-Chun Lin, Chun-Ti Lu, Chia-Hung Liu +1 more | 2023-11-28 |
| 11810963 | Gate spacer structure of FinFET device | Chung-Ting Li, Bi-Fen Wu, Jen-Hsiang Lu | 2023-11-07 |
| 11758677 | Facilitated expansion card removal | Chun Chang, Hsin-Chieh Lin, Yi-Fu Liu | 2023-09-12 |
| 11721761 | Structure and method for providing line end extensions for fin-type active regions | Shao-Ming Yu, Chang-Yun Chang, Hsin-Chih Chen, Kai-Tai Chang, Ming-Feng Shieh +2 more | 2023-08-08 |