PL

Po-Chun Lin

TSMC: 2 patents #1,466 of 4,064Top 40%
AU Auo: 1 patents #7 of 62Top 15%
Overall (2023): #64,826 of 537,848Top 15%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11855232 Semiconductor package and forming method thereof Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more 2023-12-26
11830796 Circuit substrate, package structure and method of manufacturing the same Shih-Wei Chen, Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Chia-Hung Liu +1 more 2023-11-28
11640776 Arcuate display device and driving method thereof Yu-Chu Chen, Chun-Hui Huang, Yu-Chi Kang, Yi-Hsiang Hu, Wei-Ting Chen 2023-05-02