Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chia-Hung Liu +1 more | 2023-11-28 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2023-05-30 |