Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Chia-Hung Liu +1 more | 2023-11-28 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-11-28 |
| 11824017 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Tin-Hao Kuo | 2023-11-21 |
| 11749640 | Semiconductor package and method of manufacturing the same | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2023-07-04 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11540761 | Systems and methods for facilitating exercise monitoring with real-time heart rate monitoring and motion analysis | Ching-Lin Hsieh | 2023-01-03 |