Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848233 | Semiconductor package and manufacturing method thereof | Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo, Shih-Wei Chen | 2023-07-04 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +3 more | 2023-05-09 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2023-05-09 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai | 2023-01-31 |