Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2023-12-19 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11764171 | Integrated circuit structure and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2023-09-19 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2023-09-05 |
| 11694966 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2023-07-04 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Ting Hao Kuo, Yu-Chia Lai +3 more | 2023-05-09 |