Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11804443 | Segregated power and ground design for yield improvement | Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2023-10-31 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2023-05-09 |