Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664315 | Structure with interconnection die and method of making same | Hao-Yi Tsai, Tzuan-Horng Liu | 2023-05-30 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Yu-Chia Lai +3 more | 2023-05-09 |