Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +3 more | 2023-05-09 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo +3 more | 2023-05-09 |