BS

Bor-Rung Su

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 New Taipei, TW: #609 of 1,884 inventorsTop 35%
Overall (2023): #503,353 of 537,848Top 95%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11848233 Semiconductor package and manufacturing method thereof Po-Yuan Teng, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more 2023-12-19