YH

Yu-Chih Huang

TSMC: 13 patents #193 of 4,064Top 5%
📍 Hsinchu, TX: #3 of 23 inventorsTop 15%
Overall (2023): #4,430 of 537,848Top 1%
13
Patents 2023

Issued Patents 2023

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11855232 Semiconductor package and forming method thereof Chih-Hsuan Tai, Hao-Yi Tsai, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more 2023-12-26
11847852 Manufacturing method of fingerprint sensor Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo +1 more 2023-12-19
11842993 Semiconductor device with multiple polarity groups Ying-Cheng Tseng, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more 2023-12-12
11830781 Package structure and manufacturing method thereof Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Peng Tsai +3 more 2023-11-28
11830796 Circuit substrate, package structure and method of manufacturing the same Shih-Wei Chen, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Chia-Hung Liu +1 more 2023-11-28
11747741 Substrate stage, substrate processing system using the same, and method for processing substrate Yu-Huan Chen, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu 2023-09-05
11742254 Sensor package and method Tsung-Hsien Chiang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more 2023-08-29
11741737 Fingerprint sensor in info structure and formation method Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai 2023-08-29
11727714 Fingerprint sensor device and method Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more 2023-08-15
11631658 Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai +5 more 2023-04-18
11602037 Apparatus and method for generating extreme ultraviolet radiation Yu-Huan Chen, Ming-Hsun Tsai, Shang-Chieh Chien, Heng-Hsin Liu 2023-03-07
11580767 Fingerprint sensor Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo +1 more 2023-02-14
11556065 Wafer stage and method thereof Yu-Huan Chen, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu 2023-01-17