Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11747741 | Substrate stage, substrate processing system using the same, and method for processing substrate | Yu-Chih Huang, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu | 2023-09-05 |
| 11728180 | Chip package structure with conductive adhesive layer | Kuo-Ching Hsu, Chen-Shien Chen | 2023-08-15 |
| 11602037 | Apparatus and method for generating extreme ultraviolet radiation | Yu-Chih Huang, Ming-Hsun Tsai, Shang-Chieh Chien, Heng-Hsin Liu | 2023-03-07 |
| 11556065 | Wafer stage and method thereof | Yu-Chih Huang, Ya-An PENG, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu | 2023-01-17 |
| 11553581 | Radiation source apparatus and method for using the same | Chiao-Hua Cheng, Hsin-Feng Chen, Yu-Fa LO, Yu-Kuang SUN, Wei-Shin Cheng +7 more | 2023-01-10 |