Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11848270 | Chip structure and method for forming the same | Hong-Seng Shue, Sheng-Han Tsai, Kuo-Chin Chang, Mirng-Ji Lii | 2023-12-19 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Chen-Shien Chen, Wei-Hung Lin, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-12 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11728180 | Chip package structure with conductive adhesive layer | Yu-Huan Chen, Chen-Shien Chen | 2023-08-15 |