Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830745 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11715681 | Fan-out package structure and method | Sao-Ling Chiu | 2023-08-01 |