Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11854983 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2023-12-26 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei | 2023-11-07 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2023-06-20 |
| 11569172 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2023-01-31 |