Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855018 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11652063 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |