Issued Patents 2023
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856800 | Semiconductor devices with system on chip devices | Chen-Hua Yu, Wen-Chih Chiou, Ming-Fa Chen, Sung-Feng Yeh | 2023-12-26 |
| 11855063 | Buffer design for package integration | Jie Chen, Ming-Fa Chen, Chen-Hua Yu | 2023-12-26 |
| 11854967 | Semiconductor packages | Jie Chen, Ming-Fa Chen | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2023-12-26 |
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Jie Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Der-Chyang Yeh, Chen-Hua Yu | 2023-12-19 |
| 11848267 | Functional component within interconnect structure of semiconductor device and method of forming same | Ming-Fa Chen | 2023-12-19 |
| 11846802 | Semiconductor structure | Ming-Fa Chen | 2023-12-19 |
| 11848246 | Integrated circuit package and method | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-19 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837579 | Semiconductor structure | Jie Chen, Ming-Fa Chen, Ching-Jung Yang | 2023-12-05 |
| 11837578 | Package structure | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-05 |
| 11830825 | Advanced seal ring structure and method of making the same | — | 2023-11-28 |
| 11823912 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2023-11-21 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Ming-Fa Chen | 2023-11-14 |
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2023-11-14 |
| 11817426 | Package and method of fabricating the same | Ming-Fa Chen | 2023-11-14 |
| 11810883 | Package structure | Ming-Fa Chen | 2023-11-07 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11798931 | Semiconductor package | Jie Chen, Ming-Fa Chen | 2023-10-24 |
| 11791333 | Three-dimensional integrated circuit structures and method of forming the same | Jie Chen | 2023-10-17 |
| 11789201 | Package, optical device, and manufacturing method of package | Ming-Fa Chen | 2023-10-17 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2023-10-17 |
| 11791246 | Package structure with photonic die and method | Ming-Fa Chen, Ying-Ju Chen | 2023-10-17 |