Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855029 | Semiconductor die connection system and method | Ming-Fa Chen, Chen-Hua Yu | 2023-12-26 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2023-10-17 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Ming-Fa Chen, Hsien-Wei Chen | 2023-09-12 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Meng-Wei Chiang | 2023-09-05 |
| 11735536 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-08-22 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Ming-Fa Chen | 2023-08-15 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Cheng-Hung Yeh, Po-Hsiang Huang +2 more | 2023-02-21 |