Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756951 | Layout design methodology for stacked devices | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Ka Fai Chang | 2023-09-12 |
| 11749584 | Heat dissipation structures | Po-Hsiang Huang, Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee | 2023-09-05 |
| 11715668 | Integrated antenna on interposer substrate | Bo-Jr Huang, William Wu Shen, Chin-Chou Liu, Yun-Han Lee | 2023-08-01 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Cheng-Hung Yeh, Po-Hsiang Huang, Sen-Bor Jan +2 more | 2023-02-21 |