Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694973 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2023-07-04 |
| 11586797 | Through-silicon vias in integrated circuit packaging | Fong-Yuan Chang, Chin-Chou Liu, Chin-Her Chien, Po-Hsiang Huang, Sen-Bor Jan +2 more | 2023-02-21 |