Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756951 | Layout design methodology for stacked devices | Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien | 2023-09-12 |
| 11694973 | Electromagnetic shielding metal-insulator-metal capacitor structure | Hui Yu Lee, Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang +1 more | 2023-07-04 |
| 11569146 | Semiconductor package and method of forming the same | Yong Su Han, David Ho, Ying Ying Lim | 2023-01-31 |
| 11545298 | Method of forming entangled inductor structures | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Yi-Kan Cheng | 2023-01-03 |