Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2023-09-05 |
MC
Meng-Wei Chiang
Overall (2023): #330,613 of 537,848Top 65%
1
Patents 2023