Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-12-26 |
| 11791243 | Semiconductor device and method of manufacture | Sen-Bor Jan, Hsien-Wei Chen, Ming-Fa Chen | 2023-10-17 |
| 11756901 | Seal ring for hybrid-bond | Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen, Hsien-Wei Chen | 2023-09-12 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Ming-Fa Chen, Sen-Bor Jan, Meng-Wei Chiang | 2023-09-05 |
| 11735536 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-08-22 |
| 11728247 | Manufacturing method of semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-08-15 |
| 11726408 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2023-08-15 |
| 11676908 | System and method for aligned stitching | Chang-Ching Yu, Ming-Fa Chen | 2023-06-13 |
| 11574847 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-02-07 |
| 11562982 | Integrated circuit packages and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh | 2023-01-24 |