Issued Patents 2023
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852604 | Systems and methods for reduction of oxygen tension in electrochemical biosensors | Christopher Dailey, Gary L. Hughes | 2023-12-26 |
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-12-26 |
| 11854967 | Semiconductor packages | Hsien-Wei Chen, Ming-Fa Chen | 2023-12-26 |
| 11855063 | Buffer design for package integration | Hsien-Wei Chen, Ming-Fa Chen, Chen-Hua Yu | 2023-12-26 |
| 11848271 | Redistribution layer structures for integrated circuit package | Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2023-12-19 |
| 11843459 | Spatially coupled forward error correction encoding method and device using generalized error locating codes as component codes | Vladimir Gritsenko, Vladislav Nikolaevich Obolentsev, Dmitrii Yurievich Bukhan, Aleksei Eduardovich Maevskii, Hongchen Yu +5 more | 2023-12-12 |
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen, Ching-Jung Yang | 2023-12-05 |
| 11836092 | Non-volatile storage controller with partial logical-to-physical (L2P) address translation table | Bo Fu, Chi-Chun Lai, Dishi Lai, Jian WU, Cheng-Yun Hsu +1 more | 2023-12-05 |
| 11837298 | Robustness-aware NAND flash management | Gang Zhao, Lin Chen, Qun Zhao | 2023-12-05 |
| 11829841 | Mechanical energy-based self-powering counting system | Fang Deng, Yeyun Cai, Ning Ding, Chengwei Mi, Jiachen Zhao +5 more | 2023-11-28 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2023-11-14 |
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Ying-Ju Chen, Hsien-Wei Chen | 2023-11-14 |
| 11798472 | Pixel circuit, display panel, and display device | Xueqiang Ning, Jianlei Li, Peidi HUANG, Kelin Li, Tao Gu +1 more | 2023-10-24 |
| 11798931 | Semiconductor package | Hsien-Wei Chen, Ming-Fa Chen | 2023-10-24 |
| 11791333 | Three-dimensional integrated circuit structures and method of forming the same | Hsien-Wei Chen | 2023-10-17 |
| 11782209 | Optical cross apparatus | Qian Wang, Yongping Liao | 2023-10-10 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-09-26 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Ming-Fa Chen | 2023-09-26 |
| 11763049 | Systems and methods for time series simulation | Rao Fu, Shutian Zeng, Yiping Zhuang, Agus Sudjianto | 2023-09-19 |
| 11764165 | Supporting InFO packages to reduce warpage | Ying-Ju Chen, Hsien-Wei Chen | 2023-09-19 |
| 11757108 | Production method used for single cell components sealing | — | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen | 2023-09-12 |
| 11749651 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen | 2023-09-05 |
| 11734109 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2023-08-22 |
| 11735286 | Selecting read reference voltage using historical decoding information | Bo Fu, Zining Wu | 2023-08-22 |