Issued Patents 2023
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2023-08-22 |
| 11735506 | Packages with multiple exposed pads | Hung-Yu Chou, Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl +1 more | 2023-08-22 |
| 11734109 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2023-08-22 |
| 11726695 | Electrical mirroring by NAND flash controller | Gang Zhao, Lin Chen, Wei Jiang | 2023-08-15 |
| 11726872 | Systems and methods for an ECC architecture with memory mapping | Xiaoming Zhu, Bo Fu, Zining Wu | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2023-08-15 |
| 11728334 | Three-dimensional integrated circuit structures and method of forming the same | Hsien-Wei Chen | 2023-08-15 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Ming-Fa Chen | 2023-08-01 |
| 11709789 | Command based on-die termination for high-speed NAND interface | Gang Zhao, Wei Jiang, Lin Chen | 2023-07-25 |
| 11693016 | Systems and methods for electrochemical point-of-care detection of hemoglobin | Donnie Smith, Brittney Werner, Gary L. Hughes | 2023-07-04 |
| 11695918 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2023-07-04 |
| 11695502 | Packet processing method and apparatus, and chip | Qing Chen, Jiyuan Shi | 2023-07-04 |
| 11695434 | Systems and methods for decoding error correcting codes with historical decoding information | Bo Fu, Zining Wu | 2023-07-04 |
| 11682594 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Ching-Jung Yang | 2023-06-20 |
| 11676939 | Discrete polymer in fan-out packages | Hsien-Wei Chen | 2023-06-13 |
| 11670621 | Die stack structure | Hsien-Wei Chen, Ming-Fa Chen | 2023-06-06 |
| 11664336 | Bonding structure and method of forming same | Hsien-Wei Chen, Ming-Fa Chen | 2023-05-30 |
| 11640958 | Packaged die and RDL with bonding structures therebetween | Hsien-Wei Chen | 2023-05-02 |
| 11634457 | Methods of reducing level of one or more impurities in a sample during protein purification | Nanying Bian, Christopher Gillespie, Matthew T. Stone, Mikhail Kozlov, Martin Siwak | 2023-04-25 |
| 11621214 | Semiconductor package and method for manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2023-04-04 |
| 11622110 | Methods and apparatuses for encoding and decoding video according to coding order | Yin-ji Piao, Chan-yul Kim | 2023-04-04 |
| 11621728 | Concatenated error correcting codes | Chenrong Xiong | 2023-04-04 |
| 11621232 | Semiconductor package with electromagnetic interference shielding | Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2023-04-04 |
| 11616971 | Encoding and decoding method and device for determining a decoding order between a left and a right lower blocks | Yin-ji Piao, Elena Alshina | 2023-03-28 |
| 11611353 | Quantizer for sigma-delta modulator, sigma-delta modulator, and noise-shaped method | Kunyu Wang, Li ZHOU, Minghui Chen, Ming-Syuan Chen, Wenjing Xu +1 more | 2023-03-21 |