Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Byron Lovell Williams, Jeffrey Alan West +2 more | 2023-12-19 |
| 11817374 | Electronic device with exposed tie bar | Chih-Chien Ho, Yuh-Harng Chien | 2023-11-14 |
| 11742265 | Exposed heat-generating devices | Hung-Yu Chou, Chi-Chen Chien, Yuh-Harng Chien, Steven Kummerl, Fu-Hua Yu | 2023-08-29 |
| 11735506 | Packages with multiple exposed pads | Hung-Yu Chou, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl, Jie Chen +1 more | 2023-08-22 |