Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Jeffrey Alan West +2 more | 2023-12-19 |
| 11784212 | Standalone high voltage galvanic isolation capacitors | Thomas D. Bonifield, Jeffrey Alan West, Elizabeth Costner Stewart | 2023-10-10 |
| 11688760 | IC including capacitor having segmented bottom plate | Jeffrey Alan West, Mrinal K. Das, Thomas D. Bonifield, Maxim Franke | 2023-06-27 |