Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Hung-Yu Chou, Shawn O'Connor, Byron Lovell Williams +2 more | 2023-12-19 |
| 11798979 | Integrated capacitor with sidewall having reduced roughness | Elizabeth Costner Stewart, Thomas D. Bonifield, Joseph A. Gallegos, Jay Sung Chun, Zhiyi Yu | 2023-10-24 |
| 11784212 | Standalone high voltage galvanic isolation capacitors | Thomas D. Bonifield, Byron Lovell Williams, Elizabeth Costner Stewart | 2023-10-10 |
| 11688760 | IC including capacitor having segmented bottom plate | Mrinal K. Das, Byron Lovell Williams, Thomas D. Bonifield, Maxim Franke | 2023-06-27 |
| 11574995 | High voltage isolated microelectronic device | — | 2023-02-07 |