Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848297 | Semiconductor device packages with high angle wire bonding and non-gold bond wires | Bo-Hsun Pan, Chien-Chang Li, Shawn O'Connor, Byron Lovell Williams, Jeffrey Alan West +2 more | 2023-12-19 |
| 11742265 | Exposed heat-generating devices | Chi-Chen Chien, Yuh-Harng Chien, Steven Kummerl, Bo-Hsun Pan, Fu-Hua Yu | 2023-08-29 |
| 11735506 | Packages with multiple exposed pads | Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Kummerl, Jie Chen +1 more | 2023-08-22 |