Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837775 | Microelectronic device package including antenna and semiconductor device | Rajen Manicon Murugan, Juan Alejandro Herbsommer | 2023-12-05 |
| 11784114 | Plated metal layer in power packages | Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Rajen Manicon Murugan, Liang Wan | 2023-10-10 |
| 11784113 | Multilayer package substrate with stress buffer | Guangxu Li, Rajen Manicon Murugan | 2023-10-10 |
| 11621232 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Rajen Manicon Murugan, Liang Wan | 2023-04-04 |
| 11600932 | Antenna-on-package including multiple types of antenna | Rajen Manicon Murugan | 2023-03-07 |
| 11600555 | Package substrate having integrated passive device(s) between leads | Rajen Manicon Murugan | 2023-03-07 |
| 11587899 | Multi-layer semiconductor package with stacked passive components | Naweed Anjum, Liang Wan, Michael G. Amaro | 2023-02-21 |
| 11587891 | Ceramic semiconductor package seal rings | Li Jiang, Rajen Manicon Murugan | 2023-02-21 |
| 11557722 | Hall-effect sensor package with added current path | Ming Li, Jie Chen, Enis Tuncer, Usman Mahmood Chaudhry, Tony R. Larson +3 more | 2023-01-17 |
| 11545420 | High current packages with reduced solder layer count | Liang Wan, William Todd Harrison, Manu J. Prakuzhy, Rajen Manicon Murugan | 2023-01-03 |