Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784113 | Multilayer package substrate with stress buffer | Yiqi Tang, Rajen Manicon Murugan | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784113 | Multilayer package substrate with stress buffer | Yiqi Tang, Rajen Manicon Murugan | 2023-10-10 |