Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817375 | High I/O density flip-chip QFN | Osvaldo Jorge Lopez, Tianyi Luo | 2023-11-14 |
| 11784114 | Plated metal layer in power packages | Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2023-10-10 |
| 11658130 | Conductive plate stress reduction feature | Tianyi Luo, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright | 2023-05-23 |
| 11640932 | Packaged electronic device with film isolated power stack | Tianyi Luo, Osvaldo Jorge Lopez | 2023-05-02 |