Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784114 | Plated metal layer in power packages | Jonathan Almeria Noquil, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784114 | Plated metal layer in power packages | Jonathan Almeria Noquil, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan | 2023-10-10 |