Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545420 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Rajen Manicon Murugan | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545420 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Rajen Manicon Murugan | 2023-01-03 |