Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2023-12-19 |
| 11817445 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2023-11-14 |
| 11791246 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2023-10-17 |
| 11764165 | Supporting InFO packages to reduce warpage | Jie Chen, Hsien-Wei Chen | 2023-09-19 |
| 11747317 | Underwater robot water quality data acquisition device and control method thereof | Jing Zhou, Yuchao Che, Jian Gao, Liming Zhao, Haocai Huang | 2023-09-05 |
| 11735555 | Manufacturing method of semiconductor structure | Jie Chen, Hsien-Wei Chen | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2023-08-22 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-08-01 |
| 11705343 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ming-Fa Chen | 2023-07-18 |
| 11699663 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ming-Fa Chen | 2023-07-11 |