Issued Patents 2023
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705343 | Integrated circuit package and method of forming thereof | Ming-Fa Chen, Ying-Ju Chen | 2023-07-18 |
| 11699663 | Passivation scheme design for wafer singulation | Ying-Ju Chen, Ming-Fa Chen | 2023-07-11 |
| 11682594 | Semiconductor structure including interconnection to probe pad with probe mark | Ching-Jung Yang, Jie Chen | 2023-06-20 |
| 11676942 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh | 2023-06-13 |
| 11676939 | Discrete polymer in fan-out packages | Jie Chen | 2023-06-13 |
| 11670621 | Die stack structure | Jie Chen, Ming-Fa Chen | 2023-06-06 |
| 11664336 | Bonding structure and method of forming same | Jie Chen, Ming-Fa Chen | 2023-05-30 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11640958 | Packaged die and RDL with bonding structures therebetween | Jie Chen | 2023-05-02 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2023-04-11 |
| 11626378 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | — | 2023-04-11 |
| 11621214 | Semiconductor package and method for manufacturing the same | Jie Chen, Ming-Fa Chen | 2023-04-04 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2023-03-21 |
| 11609391 | Semiconductor package and manufacturing method thereof | Jie Chen, Ming-Fa Chen | 2023-03-21 |
| 11600587 | Pad design for reliability enhancement in packages | — | 2023-03-07 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11587922 | Process control for package formation | Ming-Fa Chen | 2023-02-21 |
| 11587907 | Package structure | Tzuan-Horng Liu, Jiun-Heng Wang, Ming-Fa Chen | 2023-02-21 |
| 11574878 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Ming-Fa Chen | 2023-02-07 |
| 11574847 | Seal ring between interconnected chips mounted on an integrated circuit | Jie Chen, Ming-Fa Chen, Chih-Chia Hu | 2023-02-07 |
| 11562935 | Semiconductor structure | Ching-Jung Yang, Ming-Fa Chen | 2023-01-24 |
| 11557581 | Package structure and method of fabricating the same | Jie Chen, Ming-Fa Chen | 2023-01-17 |