JW

Jiun-Heng Wang

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #394,908 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11587907 Package structure Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen 2023-02-21