Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854993 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2023-12-26 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2023-10-31 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh | 2023-02-28 |