Issued Patents 2023
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784124 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2023-10-10 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Jie Chen, Ming-Fa Chen, Sen-Bor Jan | 2023-09-26 |
| 11764165 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2023-09-19 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11756933 | Inactive structure on SoIC | Ming-Fa Chen, Sung-Feng Yeh | 2023-09-12 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2023-09-12 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2023-09-12 |
| 11749651 | Semiconductor package and manufacturing method thereof | Jie Chen | 2023-09-05 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11735555 | Manufacturing method of semiconductor structure | Jie Chen, Ying-Ju Chen | 2023-08-22 |
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Ming-Fa Chen, Sung-Feng Yeh, Jie Chen | 2023-08-22 |
| 11735536 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Sen-Bor Jan, Chih-Chia Hu | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Ying-Ju Chen | 2023-08-22 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Ming-Fa Chen, Sen-Bor Jan | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Jie Chen, Sung-Feng Yeh | 2023-08-15 |
| 11728334 | Three-dimensional integrated circuit structures and method of forming the same | Jie Chen | 2023-08-15 |
| 11728324 | Semiconductor structure having photonic die and electronic die | Ming-Fa Chen | 2023-08-15 |
| 11728312 | Semiconductor packaging and methods of forming same | Ming-Fa Chen | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11721676 | Package structure with dummy die | Li-Hsien Huang | 2023-08-08 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Ying-Ju Chen, Jie Chen, Ming-Fa Chen | 2023-08-01 |
| 11705423 | Package structure | Sung-Feng Yeh, Ming-Fa Chen | 2023-07-18 |