Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810897 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-11-07 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2023-09-12 |
| 11742297 | Semiconductor packages | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-08-29 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |