Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855333 | Semiconductor packages and manufacturing methods thereof | Chao-Wen Shih, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2023-12-26 |
| 11705411 | Chip package with antenna element | Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih, Shou-Zen Chang +2 more | 2023-07-18 |