Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855333 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2023-12-26 |
| 11837564 | Semiconductor bonding structure | Chun-Lin Lu, Ying-Tsung Chu, Chi-Ming Chen | 2023-12-05 |
| 11800721 | Ferroelectric memory structure with different ferroelectric capacitors | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-10-24 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2023-09-05 |
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Chun-Lin Lu, Chun-Cheng Chen | 2023-09-05 |
| 11721378 | Oxide semiconductor-based FRAM | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-08-08 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2023-07-18 |
| 11658392 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2023-05-23 |
| 11610621 | Oxide semiconductor-based FRAM | Ming-Han Liao, Min-Cheng Chen, Hiroshi Yoshida | 2023-03-21 |