Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854992 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2023-12-26 |
| 11837564 | Semiconductor bonding structure | Shou-Zen Chang, Ying-Tsung Chu, Chi-Ming Chen | 2023-12-05 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2023-11-21 |
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Shou-Zen Chang, Chun-Cheng Chen | 2023-09-05 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2023-08-29 |
| 11569190 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2023-01-31 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |