Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855011 | Package structure and method of forming the same | Chung-Yi Hsu, Kai-Chiang Wu | 2023-12-26 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2023-08-29 |
| 11569562 | Semiconductor package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |