Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855046 | Memory packages and methods of forming same | Chen-Hua Yu, Chuei-Tang Wang, Yih Wang | 2023-12-26 |
| 11854928 | Semiconductor package and manufacturing method thereof | Chuei-Tang Wang, Tzu-Chun Tang, Wei-Ting Chen | 2023-12-26 |
| 11841541 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2023-12-12 |
| 11830864 | Photonic semiconductor device and method | Chih-Chieh Chang, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-11-28 |
| 11784172 | Deep partition power delivery with deep trench capacitor | Chen-Hua Yu, Chuei-Tang Wang, Chieh-Yen Chen | 2023-10-10 |
| 11769731 | Architecture for computing system package | Chen-Hua Yu, Chieh-Yen Chen, Chuei-Tang Wang | 2023-09-26 |
| 11742219 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2023-08-29 |
| 11735576 | Integrated circuit package and method | Chen-Hua Yu, Chuei-Tang Wang | 2023-08-22 |
| 11728327 | Integrated circuit package and method | Chen-Hua Yu, Chuei-Tang Wang | 2023-08-15 |
| 11682583 | Through-vias and methods of forming the same | En-Hsiang Yeh, Chuei-Tang Wang | 2023-06-20 |
| 11637097 | Method of manufacturing package structure | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang | 2023-04-25 |
| 11605622 | Photonic semiconductor device and method | Chih-Chieh Chang, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-03-14 |
| 11587916 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Tzu-Chun Tang | 2023-02-21 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2023-01-24 |