Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854928 | Semiconductor package and manufacturing method thereof | Chuei-Tang Wang, Wei-Ting Chen, Chung-Hao Tsai | 2023-12-26 |
| 11587916 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu | 2023-02-21 |